About Platinum
About Platinum
Heating/Cooling Information
Platinum crucibles are soft at room temperature, deformation increases between 700°C – 1000°C as the temperature increases.
Recommended maximum process temperature 1200°C.
During heating and cooling platinum crucibles only handle or touch with either platinum tipped or ceramic coated instruments/surfaces.
It is immune to sterilising solutions, most of the organic chemicals, dyestuffs and a wide variety of inorganic chemicals.
Notes
Platinum crucibles can become damaged, decay or fail:
- With low melting point metals such as tin, antimony and bismuth.
- Using unknown compounds, heated for first time.
- Heating in presence of carbon yellow flame – always use oxygen rich oxidising flame.
- When associated with following elements, silicone, lead, antimony and phosphorus, which may be airborne or nearby during heating.
- With sulphur.
- There are evaporation losses of platinum, even at room temperature a film of platinum oxide builds up, elevated temperatures oxidisation accelerates evaporating in use.
- Heating crucibles for long periods of time since this coarsens the grain structure leading to cracking and embrittlement.
- When heated in furnaces the ceramic floor of the furnace must be free contamination.
- Correctly space crucibles to avoid them fusing together.
- Handled with metallic objects such as tongs, tripods, meshes etc which are themselves not platinum.
Cleaning
- Boil in solvent.
Media in Crucible | °C | Corrosive Effect on Crucible | |
Aluminium sulphate | Al2(SO4)3 | 100 | Normal |
Bromine, dry | Br2 | 20 | Damage |
Bromine, moist | Br2 | 20 | Damage |
Bromine water | 20 | Normal | |
Hydrobromic acid | HBr | 20 | Corrosion |
Hydrobromic acid | HBr | 100 | Destruction |
Chlorine, dry | CI2 | 20 | Corrosion |
Chloride, moist | CI2 | 20 | Corrosion |
Acetic acid, glacial | CH3COOH | 100 | Normal |
Fluorine | F2 | 20 | Corrosion |
Hydrofluoric acid 40% | HF | 20 | Normal |
Iodine, dry | I2 | 20 | Normal |
Iodine, moist | I2 | 20 | Normal |
Hydroicdic acid | HI | 20 | Normal |
Potassium hydroxide | KOH | 400 | Damage |
Potassium cyanide | KOH | 20 | Normal |
Potassium cyanide | KOH | 100 | Damage |
Potassium bisulphate | KHSO4 | 500 | Normal |
Aqua regia | HNO3 + 3 HCI | 20 | Destruction |
Aqua regia | HNO3 + 3 HCI | 100 | Destruction |
Copper chloride | CuC12 | 100 | Normal |
Copper sulphate | CuSO4 | 100 | Normal |
Sodium hypochlorite | NaClO | 20 | Normal |
Sodium hydroxide | NaoH | 500 | Corrosion |
Ortho-phosphoric acid | H3PO4 | 100 | Normal |
Mercuric chloride | HgCI2 | 100 | Normal |
Nitric acid 95% | HNO3 | 100 | Normal |
Sulphuric acid 36% | HCI | 20 | Normal |
Sulphuric acid 65% | HCI | 20 | Normal |
Sulphuric acid 65% | HCI | 100 | Corrosion |
Sulphuric acid 96% | H2SO4 | 20 | Normal |
Sulphuric acid 96% | H2SO4 | 100 | Normal |
Sulphuric acid 96% | H2SO4 | 300 | Corrosion |
Hydrogen sulphide | H2S | 20 | Normal |
Selenic acid | H2SeO4 | 20 | Normal |
Selenic acid | H2SeO4 | 100 | Damage |
Hydrogen peroxide | H2O2 | 100 | Destruction |